Non-Destructive X-ray Inspection Technology for Electronics

YXLON industrial X-ray (DR) and computed tomography (CT) inspection systems are designed to meet requirements for safe, reliable, non-destructive testing of electronic, microelectronic, and electromechanical products.
Electronic components are becoming increasingly miniaturized. New and innovative mounting techniques are being used in wafer technology. High-resolution and high-magnification YXLON industrial X-ray and computed tomography (CT) inspection systems provide the necessary tools for the examination of such components.

Typical wafer inspection tasks include:

  • Testing of bond wires and bonding areas
  • Testing of 3D integrated circuits (IC) solder joints (micro bumps, copper pillars, Through-Silicon Vias (TSV))

It is important to find cracks, open solder joints or voids via X-ray inspection. Additionally the measurement of pore sizes and their distribution is critical. Many of these inspections are performed automatically for an improvement in the production process.

Our combined YXLON X-ray and CT inspection systems provide the highest resolution 3D non-destructive wafer failure analysis.